Handheld computing device having drop-resistant lcd display

ABSTRACT

A display for a handheld computing device includes a display panel, a display circuit board carrying display electronics for the display panel, and a light guide coupled to the display panel and the display circuit board. The light guide includes at least one snap clip for securing the display to a circuit board of the handheld computing device. The least one snap clip is configured to allow the display to move relative to the computing device when the display panel is mounted to the computing device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent application is a continuation of U.S. patent applicationSer. No. 11/526,878, entitled “Handheld Computing Device HavingDrop-Resistant LCD Display”, filed Sep. 26, 2006, which is acontinuation of U.S. Pat. No. 7,130,185, entitled “Handheld ComputingDevice Having Drop-Resistant LCD Display”, filed Jun. 2, 2004.

FIELD

This patent application relates to a handheld computing device. Inparticular, this patent application relates to a configuration for ahandheld computing device having a LCD display that is resistant toshock loading damage due to impact.

BACKGROUND

The conventional handheld computing device, such as a PDA, or a wirelesstelephone, includes a keyboard/keypad, a display assembly and a systemmotherboard (not shown) contained within a common housing. The displayassembly is typically provided as a reflective, transmissive ortransreflective LCD display panel.

To limit power losses and the effects of noise on image quality, the LCDdisplay electronics must be disposed in close proximity to the LCDdisplay panel. Accordingly, the LCD display electronics are provided ona printed circuit board that is housed within a plastic or metal supportframe, together with the LCD display panel. Typically, the displayelectronics and the LCD display panel are press-fitted within the frame,and the frame is secured to the motherboard with permanent adhesive orscrews.

The LCD display panel is prone to damage resulting from shock loadingdue to impact. Since the LCD display panel is fixed within the supportframe, and the support frame is secured to the motherboard, the LCDdisplay panel can sustain shock impact damage if the handheld computingdevice is struck or dropped.

Further, in view of the method by which the LCD display panel and theLCD display electronics are assembled together, typically the entiredisplay assembly must be discarded if the LCD display panel becomesdamaged. As a result, repairs cost are often excessively high.

Therefore, there is a need for a configuration for a handheld computingdevice that reduces the sensitivity of the LCD display panel to jarringimpact damage. Further, there is a need for a configuration for ahandheld computing device that reduces the repair costs of the displayassembly.

SUMMARY

One aspect of this disclosure relates to a display for a handheldcomputing device. The display comprises a display panel, a displaycircuit board carrying display electronics for the display panel, and alight guide coupled to the display panel and the display circuit board.The light guide includes at least one snap clip for securing the displayto a circuit board of the handheld computing device. The least one snapclip is configured to allow the display to move relative to thecomputing device when the display panel is mounted to the computingdevice.

Another aspect of this disclosure relates to a handheld computingdevice. The handheld computing device comprises a motherboard, and adisplay mounted to the motherboard. The comprises a display panel, adisplay circuit board carrying display electronics for the displaypanel, and a light guide coupled to the display panel and the displaycircuit board. The light guide includes at least one snap clip securingthe display to the motherboard. The at least one snap clip is configuredto allow the display to move relative to the motherboard.

Another aspect of this disclosure relates to a method for manufacturinga handheld computing device. The method involves providing a displaydevice, and mounting the display device to the computing device. Thedisplay device comprises a display panel, a display circuit boardcarrying display electronics for the display panel, and a light guidecoupled to the display panel and the display circuit board. The lightguide includes at least one snap clip. The display device is mounted tothe computing device by urging the display device towards themotherboard until the at least one snap clip engages an edge of themotherboard. The at least one snap clip is configured to allow thedisplay to move relative to the motherboard.

The display may also comprise a pair of opposed cover plates that arefastened to the light guide and are configured to provide ESD protectionfor the display panel and the display circuit board. The display panel,the display circuit board and the light guide may be disposed betweenthe cover plates. The cover plates may include locking tabs that fastenthe front and rear metal cover plates to the light guide. Therefore, themethod of manufacture may involve disposing the display panel and thedisplay circuit board between the cover plates, and fastening the coverplates to the light guide.

The light guide may also include at least one guide pin for aligning thedisplay with the circuit board of the computing device. The motherboardmay comprise at least one locate pin hole, and the method of manufacturemay involve aligning the at least guide pin within the at least onelocate hole. The least one guide pin and locate hole may dimensioned toallow the display device to move relative to the computing device.

The display may also include a resilient layer adhered to the displaycircuit board. The resilient layer may include a first adhesive surfaceadhered to the display circuit board and a second adhesive surfaceopposite the first adhesive surface. The resilient layer may bepositioned such that the resilient layer is disposed between the displaycircuit board and the circuit board of the computing device when thedisplay panel is mounted to the computing device. The resilient layermay be configured to support the display panel and to limit impactforces applied to the display panel when the display panel is mounted tothe computing device. The method of manufacture may involve pressing theresilient layer against the motherboard until the second adhesivesurface adheres to the motherboard.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects will now be described, by way of example only,with reference to the accompanying drawings, in which:

FIG. 1 is a front plan view of a handheld computing device;

FIG. 2 is a schematic view depicting functional details of the handheldcomputing device;

FIG. 3 is a front plan view of the motherboard of the handheld computingdevice;

FIG. 4 is a rear perspective view of the LCD display of the handheldcomputing device.

FIG. 5 is a perspective view of the resilient layer of the LCD display;

FIG. 6 is a perspective view of the LCD display, fitted with theresilient layer;

FIG. 7 is an exploded view showing the LCD display relative to themotherboard; and

FIG. 8 is a perspective view of the LCD display secured to themotherboard.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring now to FIG. 1, there is shown a handheld computing device,denoted generally as 100, that includes a display 122, a function key146 and a system motherboard 102 (not shown) disposed within a commonhousing. The display 122 is a self-contained peripheral device that isconnected to the system motherboard.

The function key 146 functions as a power on/off switch for the handheldcomputing device 100, and may also function as a backlight key for thedisplay 122.

In addition to the display 122 and the function key 146, the handheldcomputing device 100 includes user data input means for inputting datato the data processing means. As shown, preferably the user data inputmeans includes a keyboard 132, a thumbwheel 148 and an escape key 160.

Typically, the handheld computing device 100 is a two-way wirelesscommunication device having at least voice and data communicationcapabilities. Further, preferably the handheld computing device 100 hasthe capability to communicate with other computer systems over theInternet. Depending on the exact functionality provided, the wirelesshandheld computing device 100 may be referred to as a data messagingdevice, a two-way pager, a wireless e-mail device, a cellular telephonewith data messaging capabilities, a wireless Internet appliance, or adata communication device, as examples.

FIG. 2 depicts functional details of the handheld computing device 100.Where the handheld computing device 100 is enabled for two-waycommunication, the motherboard 102 will incorporate a communicationsubsystem 111, including both a receiver 112 and a transmitter 114, aswell as associated components such as one or more, preferably embeddedor internal, antenna elements 116 and 118, local oscillators (LOs) 113,and a processing module such as a digital signal processor (DSP) 120. Aswill be apparent to those skilled in the field of communications, theparticular design of the communication subsystem 111 will be dependentupon the communication network in which the device is intended tooperate. For example, the handheld computing device 100 may include acommunication subsystem 111 designed to operate within the Mobitex™mobile communication system, the DataTAC™ mobile communication system,GPRS network, UMTS network, EDGE network or CDMA network.

Network access requirements will also vary depending upon the type ofnetwork 119. For example, in the Mobitex and DataTAC networks, thehandheld computing device 100 is registered on the network using aunique identification number associated with each handheld computingdevice. In UMTS and GPRS networks, and in some CDMA networks, however,network access is associated with a subscriber or user of the handheldcomputing device 100. A GPRS handheld computing device thereforerequires a subscriber identity module (SIM) card in order to operate ona GPRS network, and a RUIM in order to operate on some CDMA networks.Without a valid SIM/RUIM card, a GPRS/UMTS/CDMA handheld computingdevice may not be fully functional. Local or non-network communicationfunctions, as well as legally required functions (if any) such as “911”emergency calling, may be available, but the handheld computing device100 will be unable to carry out any other functions involvingcommunications over the network. The SIM/RUIM interface 144 is normallysimilar to a card-slot into which a SIM/RUIM card can be inserted andejected like a diskette or PCMCIA card. The SIM/RUIM card can haveapproximately 64K of memory and hold many key configuration 151, andother information 153 such as identification, and subscriber relatedinformation.

When required network registration or activation methods have beencompleted, the handheld computing device 100 may send and receivecommunication signals over the network 119. Signals received by antenna116 through communication network 119 are input to receiver 112, whichmay perform such common receiver functions as signal amplification,frequency down conversion, filtering, channel selection and the like,and in the example system shown in FIG. 2, analog to digital (A/D)conversion. A/D conversion of a received signal allows more complexcommunication functions such as demodulation and decoding to beperformed in the DSP 120. In a similar manner, signals to be transmittedare processed, including modulation and encoding for example, by DSP 120and input to transmitter 114 for digital to analog conversion, frequencyup conversion, filtering, amplification and transmission over thecommunication network 119 via antenna 118. DSP 120 not only processescommunication signals, but also provides for receiver and transmittercontrol. For example, the gains applied to communication signals inreceiver 112 and transmitter 114 may be adaptively controlled throughautomatic gain control algorithms implemented in DSP 120.

The handheld computing device 100 preferably includes a microprocessor138 which controls the overall operation of the device. Communicationfunctions, including at least data and voice communications, areperformed through communication subsystem 111. Microprocessor 138 alsointeracts with further device subsystems such as the display 122, flashmemory 124, random access memory (RAM) 126, auxiliary input/output (I/O)subsystems 128, serial port 130, keyboard 132, speaker 134, microphone136, a short-range communications subsystem 140 and any other devicesubsystems generally designated as 142.

Typically, the communication subsystem 111, flash memory 124, RAM 126,I/O subsystems 128, serial port 130, keyboard 132, speaker 134,microphone 136, microprocessor 138, and the subsystems 140, 142 areprovided on the motherboard 102, and the display 122 is provided as aself-contained unit that is physically mounted, and electricallyconnected, to the motherboard 102. This point will be discussed infurther detail below.

Some of the subsystems shown in FIG. 2 perform communication-relatedfunctions, whereas other subsystems may provide “resident” or on-devicefunctions. Some subsystems, such as keyboard 132 and display 122, forexample, may be used for both communication-related functions, such asentering a text message for transmission over a communication network,and device-resident functions such as a calculator or task list.

The operating system software used by the microprocessor 138 ispreferably stored in a persistent store such as flash memory 124, whichmay instead be a read-only memory (ROM) or similar storage element (notshown). Those skilled in the art will appreciate that the operatingsystem, specific device applications, or parts thereof, may betemporarily loaded into a volatile memory such as RAM 126. Receivedcommunication signals may also be stored in RAM 126.

As shown, the flash memory 124 can be segregated into different areasfor both computer programs 158 and program data storage 150, 152, 154and 156. These different storage areas indicate that each program canallocate a portion of flash memory 124 for their own data storagerequirements. In addition to its operating system functions, preferablythe microprocessor 138 enables execution of software applications on thehandheld computing device. A predetermined set of applications thatcontrol basic operations, will normally be installed on the handheldcomputing device 100 during manufacturing. One set of basic softwareapplications might perform data and/or voice communication functions,for example.

A preferred software application may be a personal information manager(PIM) application having the ability to organize and manage data itemsrelating to the user of the handheld computing device such as, but notlimited to, e-mail, calendar events, voice mails, appointments, and taskitems. Naturally, one or more memory stores would be available on thehandheld computing device to facilitate storage of PIM data items. SuchPIM application would preferably have the ability to send and receivedata items, via the wireless network 119. In a preferred embodiment, thePIM data items are seamlessly integrated, synchronized and updated, viathe wireless network 119, with the user's corresponding data itemsstored or associated with a host computer system.

Further applications may also be loaded onto the handheld computingdevice 100 through the network 119, an auxiliary I/O subsystem 128,serial port 130, short-range communications subsystem 140 or any othersuitable subsystem 142, and installed by a user in the RAM 126 orpreferably a non-volatile store (not shown) for execution by themicroprocessor 138. Such flexibility in application installationincreases the functionality of the device and may provide enhancedon-device functions, communication-related functions, or both. Forexample, secure communication applications may enable electroniccommerce functions and other such financial transactions to be performedusing the handheld computing device 100.

In a data communication mode, a received signal such as a text messageor web page download will be processed by the communication subsystem111 and input to the microprocessor 138, which preferably furtherprocesses the received signal for output to the display 122, oralternatively to an auxiliary I/O device 128. A user of the handheldcomputing device 100 may also compose data items such as email messagesfor example, using the keyboard 132, which is preferably a completealphanumeric keyboard or telephone-type keypad, in conjunction with thedisplay 122 and possibly an auxiliary I/O device 128. Such composeditems may then be transmitted over a communication network through thecommunication subsystem 111.

For voice communications, overall operation of the handheld computingdevice 100 is similar, except that received signals would preferably beoutput to a speaker 134 and signals for transmission would be generatedby a microphone 136. Alternative voice or audio I/O subsystems, such asa voice message recording subsystem, may also be implemented on thehandheld computing device 100. Although voice or audio signal output ispreferably accomplished primarily through the speaker 134, display 122may also be used to provide an indication of the identity of a callingparty, the duration of a voice call, or other voice call relatedinformation for example.

Serial port 130 in FIG. 2, would normally be implemented in a personaldigital assistant (PDA)-type handheld computing device for whichsynchronization with a user's desktop computer (not shown) may bedesirable. The serial port 130 enables a user to set preferences throughan external device or software application and would extend thecapabilities of the handheld computing device 100 by providing forinformation or software downloads to the handheld computing device 100other than through a wireless communication network.

Other communications subsystems 140, such as a short-rangecommunications subsystem, is a further optional component which mayprovide for communication between the handheld computing device 100 anddifferent systems or devices, which need not necessarily be similardevices. For example, the subsystem 140 may include an infrared deviceand associated circuits and components or a Bluetooth™ communicationmodule to provide for communication with similarly enabled systems anddevices.

FIG. 3 depicts the physical structure of the motherboard 102. Asdiscussed above, the communication subsystem 111 (including the receiver112, transmitter 114, and antenna elements 116, 118), flash memory 124,RAM 126, I/O subsystems 128, serial port 130, keyboard 132, speaker 134,microphone 136, microprocessor 138, and the subsystems 140, 142 areprovided on the motherboard 102.

FIG. 4 is a rear perspective view of the display 122. The display 122 isprovided as a self-contained unit that is physically mounted, andelectrically connected, to the motherboard 102. The display 122 includesa display panel 103 (see FIG. 7), and a printed circuit board 104 thatcarries the display electronics. The printed circuit board 104 may beprovided as a rigid, flexible or semi-rigid circuit board. Preferably,the display panel 103 comprises a glass LCD display panel Alternately,however, the display panel 103 may comprise a plastic LCD display panel.

The display panel 103 and the display circuit board 104 are retainedtogether within a cover assembly 105 that secures the display panel 103to the display circuit board 104. Preferably, the cover assembly 105comprises a front metal cover plate, and a rear metal cover plate thatis coupled to the front cover plate. In addition to securing the displaypanel 103 to the display circuit board 104, the front and rear metalcover plates provide ESD protection for the display panel 103 and thedisplay circuit board 104.

The display 122 also includes a resilient layer 106 (see FIG. 7) that isdisposed between the circuit board 104 and the motherboard 102. As shownin FIG. 5, the resilient layer 106 includes an upper horizontal end 123a, a lower horizontal end 123 b, and a pair of vertical sides 125 a, 125b extending between the horizontal ends 123 a, 123 b. The resilientlayer 106 has a first adhesive surface that adheres the resilient layer106 to the circuit board 104, and a second adhesive surface that adheresthe resilient layer 106 to the motherboard 102. Typically, the firstadhesive surface is a permanent adhesive surface, and the secondadhesive surface is a removable adhesive surface, although theproperties of the first and second adhesive surfaces could be reversed.Alternately, however, both the first and second adhesive surfaces couldcomprise removable or permanent adhesive surfaces, if desired.

Preferably, the second adhesive surface comprises a repositionaladhesive that is provided only at selected locations on the secondadhesive surface so as to allow for easier removal of the display 122from the motherboard 102. In particular, as shown in FIG. 6, preferablythe repositional adhesive is disposed along the upper and lowerhorizontal ends 123 of the resilient layer 106, but not along thevertical sides 125. Alternately, the repositional adhesive may bedisposed along the vertical sides 125 of the resilient layer 106, butnot along the upper horizontal end 123. Other configurations for therepositional adhesive will be apparent. For instance, the repositionaladhesive may be disposed at the corners of the resilient layer 106.

Preferably, the resilient layer 106 comprises a slow rebound urethanefoam layer that absorbs shear and impact forces. The resilient layer 106is selected such that when the display 122 is adhered to the motherboard102, and shear and impact forces are applied to the display panel 103,the resilient layer 106 absorbs those forces and thereby limits thelikelihood of the display panel 103 becoming damaged.

In addition to the resilient layer 106, the display 122 also includes abacklight (not shown), and a light guide frame 121 that is disposedbetween the backlight and the display panel 103. The backlight and thelight guide frame 121 are sandwiched between the front and rear coverplates of the cover assembly 105. The front and rear cover platesinclude locking tabs (not shown) that fasten the front and rear metalcover plates to the light guide frame 121. From front to back, thedisplay 122 comprises the front cover plate, the display panel 103, onepair of orthogonal brightness enhancing films, a light diffuser film,the light guide frame 121, the backlight, a light reflective plate, theprinted circuit board 104 and the rear cover plate.

The light guide frame 121 includes two pairs of snap clips 107 a, 107 b,107 c, 107 d that extend towards the motherboard 102, and assist insecuring the display 122 to the motherboard 102 of the handheldcomputing device. 100. The snap clips 107 include laterally-opposed headportions 108 that loosely engage the opposing edges of the motherboard102 so as to allow the display 122 to move towards or away from themotherboard 102, within a limited range as defined by the snap clips107.

Preferably, the light guide frame 121 also includes a pair of pins 109a, 109 b that extend towards the motherboard 102. The pins 109 a, 109 bare received in correspondingly-located holes 110 a, 110 b that areformed in the motherboard 102, and serve to align the display 122 withthe motherboard 102. The holes 110 are slightly oversized so as to allowthe display 122 to move laterally relative to the motherboard 102,within a limited range as defined by the snap clips 107 and the size ofthe holes 110. Although the light guide frame 121 is shown having twopairs of snap clips 107, and a pair of pins 109, it should be understoodthat the light guide frame 121 may have any number of the clips 107 andthe pins 109, as required by the dimensions and shape of the display122.

The display 122 is mounted to the motherboard 102 by aligning the pins109 a, 109 b with the locate holes 110 on the motherboard 102, and thenpressing the display 122 against the proximate surface of themotherboard 102, so that the second adhesive surface of the resilientlayer 106 adheres to the motherboard 102. At the same time, the snapclips 107 loosely engage the edges of the motherboard 102, with theassociated head portions 108 loosely engaging the opposite surface ofthe motherboard 102.

When the display 122 is mounted to the motherboard 102, the display 122is resiliently mounted to the mother board 102, in that the resilientproperties of the resilient layer 106 allows the display 122 to moveslightly (towards, away, and laterally) relative to the motherboard 102.As a result, if the handheld computing device 100 is struck or dropped,the impact forces applied to the display panel 103 will be less thanprior art computing devices. Accordingly, the likelihood of the displaypanel 103 of sustaining damage from such an impact is reduced.

For a handheld computing device 100 which has a 2.2 inch LCD display 122(with a module thickness of 3.2 mm), favourable drop testcharacteristics (at a drop height up to one metre) can be obtained usinga 0.53 mm resilient layer 106 thickness of Rogers Corporation PORON(trademark) cellular, extra soft, slow rebound PET-supported urethanefoam P/N 4790-92-25021-04. The PET-supported side of the resilient layer106 is coated with a 0.051 mm of 3M 9667, 467 MP or 467 MPF permanentadhesive, and the other side is selectively coated with 0.063 mm ofAdchem 8311 M-74 low tack removable adhesive. As will be apparent, for alarger LCD display 122 (or a thinner, more fragile LCD display 122), thethickness of the resilient layer 106 would be increased.

A number of factors (such as the size and mass of the display 122 andthe environment in which the handheld computing device 100 will be used)will dictate the characteristics of the resilient layer 106, theadhesives applied to the resilient layer 106. For example, to facilitateease of disassembly (eg. for repair purposes), the surface area overwhich the repositional adhesive is applied to the resilient layer 106should be as small as possible. On the other hand, the surface area overwhich the permanent and repositional adhesives are applied to theresilient layer 106, and the adhesive characteristics of the adhesivesthat are applied to the resilient layer 106, should be selected so thatthe display 122 will not become dislodged from the motherboard 102 whenthe handheld computing device 100 is exposed to impact forces typical ofthose encountered during use of the handheld computing device 100.

To reduce the likelihood of impact damage to the display panel 103,preferably the adhesives are applied symmetrically to the resilientlayer 106, and the resilient layer 106 itself has a symmetrical shape,so as to cause the impact forces to be applied uniformly to the displaypanel 103. Further, since there are no compression forces from the frontcover plate to balance the rear support forces from the rear cover plateat the centre of the display panel 103, preferably the resilient layer106 has a hole cut in its centre to thereby support the display panel103 at its outer edges.

1. A display for a handheld computing device, comprising: a display panel; a display circuit board carrying display electronics for the display panel; and a light guide coupled to the display panel and the display circuit board, the light guide including at least one snap clip for securing the display to a circuit board of the handheld computing device, the at least one snap clip being configured to allow the display to move relative to the computing device when the display panel is mounted to the computing device.
 2. The display according to claim 1, further comprising a pair of opposed cover plates fastened to the light guide and being configured to provide ESD protection for the display panel and the display circuit board.
 3. The display according to claim 2, wherein the display panel, the display circuit board and the light guide are disposed between the cover plates.
 4. The display according to claim 2, wherein the cover plates include locking tabs that fasten the front and rear metal cover plates to the light guide.
 5. The display according to claim 1, wherein the light guide includes at least one guide pin for aligning the display with the circuit board of the computing device.
 6. The display according to claim 1, further comprising a resilient layer adhered to the display circuit board, the resilient layer being positioned such that the resilient layer is disposed between the display circuit board and the circuit board of the computing device when the display panel is mounted to the computing device.
 7. The display according to claim 6, wherein the resilient layer is configured to support the display panel and to limit impact forces applied to the display panel when the display panel is mounted to the computing device.
 8. A handheld computing device comprising: a motherboard; and a display mounted to the motherboard, the display comprising: a display panel; a display circuit board carrying display electronics for the display panel; and a light guide coupled to the display panel and the display circuit board, the light guide including at least one snap clip securing the display to the motherboard, the at least one snap clip being configured to allow the display to move relative to the motherboard.
 9. The handheld computing device according to claim 8, further comprising a pair of opposed cover plates fastened to the light guide and being configured to provide ESD protection for the display panel and the display circuit board.
 10. The handheld computing device according to claim 8, wherein the display panel, the display circuit board and the light guide are disposed between the cover plates.
 11. The handheld computing device according to claim 9, wherein the cover plates include locking tabs that fasten the front and rear metal cover plates to the light guide.
 12. The handheld computing device according to claim 8, wherein the light guide includes at least one guide pin for aligning the display with the motherboard.
 13. The handheld computing device according to claim 8, further comprising a resilient layer adhered to the display circuit board, the resilient layer being positioned between the display circuit board and the motherboard.
 14. The handheld computing device according to claim 13, wherein the resilient layer is configured to support the display panel and to limit impact forces applied to the display panel.
 15. The handheld computing device according to claim 14, wherein the resilient layer is configured to cause the applied impact forces to be applied substantially uniformly to the display panel.
 16. A method of manufacturing a handheld computing device, comprising: providing a display device, the display device comprising a display panel, a display circuit board carrying display electronics for the display panel, and a light guide coupled to the display panel and the display circuit board, the light guide including at least one snap clip; and mounting the display device to the computing device by urging the display device towards the motherboard until the at least one snap clip engages an edge of the motherboard, the at least one snap clip being configured to allow the display to move relative to the motherboard.
 17. The method according to claim 16, wherein the display providing comprises disposing the display panel and the display circuit board between a pair of opposed cover plates, the cover plates being configured to provide ESD protection for the display panel and the display circuit board.
 18. The method according to claim 17, wherein the display providing further comprises fastening the cover plates to the light guide.
 19. The method according to claim 16, wherein the light guide comprise at least one guide pin, and the motherboard comprises at least one locate pin hole, and the mounting comprises aligning the at least guide pin within the at least one locate hole, the at least one guide pin and locate hole being dimensioned to allow the display device to move relative to the computing device.
 20. The method according to claim 16, wherein the display providing further comprises adhering a resilient layer to the display circuit board, the resilient layer including a first adhesive surface adhered to the display circuit board and a second adhesive surface opposite the first adhesive surface, and the mounting comprises pressing the resilient layer against the motherboard until the second adhesive surface adheres to the motherboard. 